Thomas H. Lee received the Sc.D. degree in electrical engineering, all from the Massachusetts Institute of Technology in 1990. He joined Analog Devices in 1990 and then Rambus Inc. in Mountain View, CA in 1992. Since 1994, he has been a Professor of Electrical Engineering at Stanford University where his research focus has been on gigahertz-speed wireline and wireless integrated circuits built in conventional silicon technologies, particularly CMOS.He has twice received the "Best Paper" award at the International Solid-State Circuits Conference, co-authored a "Best Student Paper" at ISSCC, was awarded the Best Paper prize at CICC,  and is a Packard Foundation Fellowship recipient. He holds 57 U.S. patents and authored The Design of CMOS Radio-Frequency Integrated Circuits(now in its second edition), and Planar Microwave Engineering, both with Cambridge University Press. He cofounded Matrix Semiconductor (acquired by Sandisk in 2006). He is the founder of ZeroG Wireless. In early April of 2011 he was awarded the Ho-Am Prize in Engineering (colloquially known as the "Korean Nobel").
Shyh-Jye Jou received the M.S. and Ph.D. degrees in electronics from National Chiao Tung University, Hsinchu, Taiwan, in 1984 and 1988, respectively. He joined the Electrical Engineering Department, National Central University, Chung-Li, Taiwan, from 1990 to 2004 and became a Professor in 1997. Since 2004, he has been a Professor with the Electronics Engineering Department, National Chiao Tung University and became the Chairman from 2006 to 2009. In August 2011, he became the Dean of Office of International Affair. He was a visiting research Professor with the Coordinated Science Laboratory, University of Illinois, Urbana-Champaign, during 1993–1994 and 2010 academic years. In the summer of2001, he was a visiting research consultant with Agere Systems. He has published over 100 IEEE journal and conference papers. His research interests include design and analysis of high speed, low power mixed-signal integrated circuits, communication and Bio-Electronics integrated circuits and systems. Prof. Jou served on the technical program committees in CICC, A-SSCC, ICCD, ISCAS, ASP-DAC, VLSI-DAT, and other international conferences.
Ichiro Fujimori received the B.S. degree in Electrical Engineering from the Science University of Tokyo in 1985, and the PhD degree from the University of Hiroshima in 2003. In 1985 he joined Asahi-Kasei Microsystems (AKM), Japan, where he was engaged in the design and development of high-resolution Delta-Sigma data converters for Digital-Audio and Communications applications. In 2000, Dr. Fujimori joined Newport Communications (later acquired by Broadcom). As the Manager of Mixed-Signal Engineering, he led the team to the development of the first CMOS transceiver LSI’s for SONET OC-192 applications, and the first IEEE 802.3ae “10GE LAN PHY” SOC where the 10-Gbps transceivers and the sub-layer system (XAUI) were integrated on the same chip. He is currently the Vice President of Central Engineering at Broadcom Corporation, responsible for the IP roadmap and development of multi-gigabit SerDes for Networking, transceivers for Optical Communications, Ethernet Copper PHY’s, PLL’s, and embedded Power Management circuits. Dr. Fujimori is an IEEE Fellow, and the recipient the IEEE Journal of Solid-State Circuits, Best Paper Award 2000. He has published 30 technical articles, and has conducted various Seminars, Invited talks, and Panels in the field of Data Converters and Wireline Communications. He currently serves in the Technical Program Committee of International Solid State Circuits Conference and the VLSI Circuits Symposium. He also serves as the Associate Editor of the IEEE Journal of Solid-State Circuits. He holds 32 U.S. patents.
Mike Shuo-Wei Chen received his Ph.D. degree from the University of California, Berkeley in 2006.  His area of research is on low-power and high-speed data converters, Ultra-wideband communication system design, digital baseband processors and digital ASIC implementation.  From 2006-2010, he was with Atheros Communications working on mixed-signal and RF circuits for various wireless and wireline communication systems. Dr. Chen achieved an honorable mention in the Asian Pacific Mathematics Olympiad in 1994.  He was the recipient of UC Regents' Fellowship at Berkeley in 2000 and the Analog Devices Outstanding Student Award in 2006. He is currently with the University of Southern California.
Hector de Jesus Ruiz is a founder of Bull Ventures, LLC, and serves as the company's Chief Executive Officer. Dr. Ruiz currently advises individuals, corporations and governments worldwide on technology initiatives and on bringing these strategies to fruition. Dr. Ruiz's distinguished professional career began at Texas Instruments. He went on to Motorola, where throughout two decades of service he rose from running a microchip manufacturing facility in Scotland, to becoming President of Motorola's Semiconductor Products Sector.In 2000, Dr. Ruiz joined AMD as President and Chief Operating Officer and in April 2002 was named Chief  Executive  Officer.  In  2009 he led an industry transformation by spinning out AMD's manufacturing assets to form GLOBALFOUNDRIES, the world's first truly global leading-edge semiconductor manufacturing company. During his tenure at AMD, Dr. Ruiz received numerous accolades, including: the Semico Bellwether Award (2009); Executive of the Year - 2005 (EE Times); CEO of the Year – 2005 (Electronic Business); and Top 25 Business Leader - 2006 (FORTUNE Magazine), among others.
Payam Heydari received his Ph.D. degree from the University of Southern California in 2001. He is currently a professor of electrical engineering and the EECS associate chair for graduate affairs at the University of California, Irvine. Dr. Heydari is the recipient of a number of awards, including the Best Paper Award at the2000 IEEE ICCD, and the 2001 Technical Excellence Award from the Association of Professors and Scholars of Iranian Heritage (APSIH), the Low-Power Design Contest Award at the 2008 IEEE ISLPED. His research interests include design of ultra-high frequency analog and RF ICs, and high frequency on-chip interconnect design for high-speed ICs. Results of the research in the NCIC Lab have appeared in more than 70 peer-reviewed journal and conference papers.
Kou-Hung Lawrence Loh joined IMP Inc., in 1991 as a Staff Engineer. From 1993 to 1998, Dr. Loh was with Cirrus Logic Inc., where his last position was Director of Analog IC Engineering to lead the company’s various mixed-signal design activities. In 1998, Dr. Loh became an independent consultant and later founded Silicon Bridge Inc., where he successfully led a number of consulting/technology development projects with major US and Taiwan fabless semiconductor companies including MediaTek Inc., Altera Corporation, Faraday and VIA Technology, etc. Dr. Loh joined as the CTO/ASIC in early 2004, he had contributed to the mixed-signal IC industry in areas of optical storage read channels, analog front-end,servo signal processors, multi-gigabit Serializer/Deserializer(SerDes)-based transceivers for mass storage, video and network applications. In October 2004, Dr. Loh joined MediaTek Inc., Hsinchu, Taiwan, a world-leading fabless semiconductor company in wireless communications, connectivity/networking, optical storage, digital home and consumer business. From 2005 to 2010, he represented MediaTek and served in ISSCC Technical Program Committee (ITPC). Dr. Loh currently holds the position of Corporate Vice President, responsible for MediaTek’s centralized global silicon/circuit engineering group with emphasis in RF, analog/mixed-signal circuits design engineering and products/technologies development.

The Fourth Age of Wireless, the Internet of Everything, and the First Trillion Connected Devices

Dr. Thomas H. Lee, Stanford University

Abstract: Wireless has evolved through three distinct ages, starting with Marconi's station-to-station spark telegraphy, moving on to station-to-people broadcasting, to today's people-to-people cellular. The number of wirelessly connected nodes has correspondingly grown from Marconi's hundreds to the Third Age's saturation at a number of subscriptions roughly equal to the world's population. This talk will discuss how this saturation is inevitably stimulating a Fourth Age, in which things are being added to the conversation. Some projections have a trillion devices being networked together within the next decade, but getting there from here will require a revolution in how we approach the design of ICs and systems.

Terahertz and Millimeter-Wave Frequency Generation and Synthesis in Silicon

Dr. Payam Heydari, University of California, Irvine

Abstract: THz and millimeter-wave (mm-wave) imaging and sensing is considered to be one of the emerging and disruptive technologies over the next decade. THz (including the W-band) waves  pass through non-conducting materials such as clothes, paper, wood and brick and so cameras sensitive to them can peer inside envelopes, into living rooms and "frisk" people at distance. THz/mm-wave imaging and sensing systems, therefore, will be key enabling components in applications such as security surveillance (to find concealed weapons and explosives), non-destructive testing, biology, radio astronomy, multi-gigabit wireless connectivity, and medical imaging. One of the most critical and daunting tasks in a THz/mm-wave system is signal generation and frequency synthesis. This invited talk presents an overview and comparative study of recent research efforts which have explored several circuit techniques and architectures leading to highly efficient frequency synthesis and signal generation in silicon.

Grand Challenges of Circuits and Systems: Green IOT-Connected People and Connected Machines

Dr. Shyh-Jye Jou, National Chiao Tung University, Taiwan

Abstract: The major focus of this talk is the “Green” of the transmitters and receivers (TxRx). For all the “Internet-of-Thing”, from overall system point of view, one of the key challenge is to achieve the lowest energy for transmission of useful data among each connected system. In the near future, we will see tremendous changes in the way of transmission in the IOTs. In this talk, several grand challenges of “Green” for different TxRxs of IOTs will be highlighted and addressed.

The End of Moore's Law - Going Vertical

Dr. Hector de Jesus Ruiz, Advanced Nanotechnology Solutions, Inc.

Abstract: Real physical limitations are straining the ability of architecture and chip designers to be innovative and productive when the silicon dimensions are approaching 20 nm and below.  This talk will attempt to explain why "going vertical" opens up a plethora of opportunities to reduce space, cost, energy consumption, and improve performance beyond anything that current traditional two dimensional trends predict.  Equally important, "going vertical" also presents us with an inflection point that could once again propel USA based manufacturing into prominence.

Advanced Wireline Transceivers in Nanometer CMOS (Enabling the Cloud)

Dr. Ichiro Fujimori, Broadcom Corporation

Abstract: The Internet Infrastructure is rapidly expanding to meet demands of increasing Internet traffic due to Cloud Computing/Storage and Social Networking. Wireline Transceivers are the data throughput bottleneck for SoCs used in Data Centers, as well as provide the communication backbone for Data Transport Networks. With the Moore’s law slowing down, the necessary cost reduction and bandwidth extension with diversified link requirements cannot be achieved by simply taking advantage of a new technology node. As a result, architecture and circuit innovations have become more important than ever for multi-gigabit Wireline Transceivers. Designers will need to explore key questions such as: Analog vs. DSP-based Transceivers, NRZ vs. PAM Coding, and Copper vs. Optical Interconnects to come up with the most competitive solution. This talk will provide further insights into these questions, as well as cover the latest advancements in such Wireline Transceivers and Wireline Communications applications.

Path Towards Direct RF Synthesis: A Hybrid Digital-to-Analog Converter Architecture

Dr. Mike Shuo-Wei Chen, University of Southern California

Abstract: There are increasing interests in wideband and flexible waveform synthesis in many modern civilian and military communication systems. One promising approach of such vision is the ability to directly synthesize any desirable signals without the need of frequency conversion, i.e. direct RF synthesis. It achieves the maximal flexibility since arbitrary waveforms can be easily generated in the digital domain, provided that the digital-to-analog converter (DAC) is able to support the required high dynamic range and bandwidth.  Conventionally, the wideband and high dynamic range DACs are implemented in compound semiconductor due to its superior device characteristics but come with higher cost. On the other hand, the pure CMOS technology driven by Moore’s Law continues to re-shape the industry, particularly in the digital computation and storage. Meanwhile, it also allows the circuit designers to transform existing analog circuit architectures that benefit from this comparatively low-cost and high-volume technology. In this talk, we will first overview the challenges and existing approaches of achieving wideband, high dynamic range DAC. We will then introduce the concept of a hybrid DAC architecture recently developed at USC, aiming at pure CMOS technology. The proof-of-concept silicon prototype in 65nm has been implemented and demonstrated the record linearity among the published high-speed (>GS/s) CMOS DACs. The proposed architecture is expected to further improve its performance over more advanced technology nodes, and hopefully show a path towards low-cost direct RF synthesis.

Opportunities and IC Design Challenges for Smart Mobile Platforms

Dr. Kou-Hung Lawrence Loh, MediaTek Inc.

Abstract:The demands in mobility have spurred the evolution of communication standards and mobile platforms. As smart mobile devices such as smartphones and tablets have become the center of our daily life, the amount of data that needs to be communicated across internet and among multiple smart mobile devices has exploded. To support such rapid growth, there are great challenges in developing the underlying circuits and systems such as in wireless, wireline and data converter areas. With the constraints of portable-device form factors and limited improvement in battery technologies, the energy and thermal gaps for mobile platforms also present major technical hurdles. To be truly mobile, wireless charging systems have gained strong momentum to cut the last wire. In this talk, we will review these design challenges followed by the trends of emerging technologies. The user demands not only push the technology development to its extreme but also open up tremendous opportunities for a higher degree of innovations.